1. Introduction: ePad TSSOP/MSOP/SOIC/SSOP Overview

️· What it is: ePad TSSOP, MSOP, SOIC, and SSOP are IC packages designed for optimal thermal performance, compact size, and tight lead pitch.
️· Benefits: They offer:
- Increased heat dissipation.
- Reduced size.
- Value-added, low-cost solutions.
️· Compliance: They adhere to RoHS and Pb-free standards ("green BOM").

2. Thermal Performance Data

️· Testing Condition: Forced convection on a single-layer PCB.
️· Table Summary: The table provides θJA (thermal resistance) values (°C/W) for different package sizes at varying air velocities (0, 200, and 500 LFPM).
- TSSOP 16: θJA values range from 37.6 to 30.2 °C/W.
- TSSOP 20: θJA values range from 37.6 to 29.9 °C/W.
- TSSOP 28: θJA values range from 37.6 to 29.0 °C/W.
- MSOP 10: θJA values range from 38.0 to 31.0 °C/W.
- SOIC 8: θJA values range from 58.6 to 49.4 °C/W.

3. Electrical Performance Data

️· Testing Condition: Simulated results at 100 MHz.
️· Table Summary: The table provides inductance (nH) and corner resistance (mΩ) values for different package sizes.
- TSSOP 16: Inductance = 1.58 nH, Resistance = 2.28 mΩ.
- TSSOP 16 (different size): Inductance = 1.68 nH, Resistance = 2.45 mΩ.
- TSSOP 16 (different size): Inductance = 1.70 nH, Resistance = 1.65 mΩ.
- TSSOP 16 (large size): Inductance = 1.90 nH, Resistance = 2.85 mΩ.
- MSOP 8: Inductance = 1.50 nH, Resistance = 2.20 mΩ.

4. Reliability Qualification

️· Testing: Packages undergo qualification processes.
️· Specific Tests & Criteria:
- Moisture sensitivity characterization: JEDEC Level 3 (30°C/60% RH, 192 hours).
- uHAST: 130°C/85% RH, no bias, 96 hours.
- Temperature cycling: -65°C to +150°C, 500 cycles.
- High-temperature storage: 150°C, 1000 hours.

5. Services and Support

️· Amkor offers services including:
- Package characterization.
- Thermal/mechanical/electrical performance modeling.
- Turnkey assembly, testing, and drop-ship.
- World-class reliability testing and failure analysis.

6. Configuration Options (Dimensions)

️· Table Summary: Provides key dimensional data (body width, length, thickness, standoff, overall height, lead pitch, tip-to-tip distance) for various sizes and types of ePad packages. Includes TSSOP (sizes 8, 14, 40, 20, 28, and 38), MSOP (sizes 8 and 10), SOIC (sizes 8 and 16), and SSOP (size 36).

7. Contact Information

️· Visit amkor.com or email sales@amkor.com for more information.

Important Notes:

️· "Estimated" Data: Several data points are marked as "Estimated," indicating they may not be final or definitive.
️· JEDEC Standards: References to JEDEC standards (e.g., for moisture sensitivity) mean the packages meet certain industry-defined quality and performance criteria.
️· "Green BOM": This refers to the Bill of Materials (BOM) being compliant with environmental regulations, specifically RoHS (Restriction of Hazardous Substances).