TSSOP / Amkor Technology - Datasheet(PDF) Chat AI

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Part No.	TSSOP
Manufacturer	AMKOR
Size	411 Kbytes
Pages	2 pages
Description	Silver Wirebonding

Datasheet Summary with AI

# Silver Wirebonding

A huge increase in the price of gold (Au) has driven the need for lower
cost wire materials. Ag-Alloy offers properties similar to gold while being a lower-cost alternative to gold bond wires.

## Package Families

️· CABGA
️· PSOP
️· LQFP
️· SC70
️· MicroLeadFrame® (QFN)
️· SCSP
️· MQFP
️· SOIC
️· PBGA
️· SOT-23
️· PDIP
️· SSOP
️· PLCC
️· TQFP
️· fcCSP
️· TSSOP

## Ag-Alloy Wire Readiness

Process Nodes Inline Bond Pad Pitch Staggered Bond Pad Pitch Standof Stitch Bonding Pad Pitch

In Production 14 nm 40 µm 25/50 µm 50 µm

In Development <14 nm 35 µm 20/40 µm 40 µm

## Ag-Alloy Wire Benefits

️· Softer than Cu wire (less Al-Splash, reduced bond pad damage)
️· Wider process window (improves manufacturability)
️· Lower cost compared to Au and PCC
️· Ultra-low loop capability

## Material Comparison

Feature Ag-Alloy Au Au PCC

Wire Cost Lower Cost Expensive Lowest Cost

FAB Hardness Soft Soft Hard

Process Window Wide Wide Narrow

AI Splash Minimal Minimal More

Resistivity Good Better Best

## Physical Properties

Property Ag-Alloy Au Au PCC

Hardness (Hv) - EFO = 120 mA 50~60 44~49 70~80

Hardness (Hv) - HAZ 50~60 44~49 55~65

Hardness (Hv) - Wire 60~70 49~55 60~70

HAZ Length (µm) 60~80 60~80 80~100

Density (g/cm2) 10.58 19.2 8.98

Elastic Modulus (GPa) 60~70 80~90 90~100

Recrystallization Temp. (°C) 500~550 500~550 500~550

Melting Point (°C) 980~1010 1060~1080 1080~1100

Fusing Current (A, Length = 10 mm) 0.44 0.47 0.58

Resistivity (µΩ·cm) @ 20°C 3.3 2.9 1.9

Thermal Conductivity (W/m·K) 429 317 401

Coefficient of Thermal Expansion (×10-6/K) 19 14 17

Elongation (%) 2~12 2~7 3~17

Purity (%) >95% >99% 99.98

Contact [amkor.com or email](https://amkor.com/) [sales@amkor.com](mailto://sales@amkor.com) for more information.

Process Nodes	Inline Bond Pad Pitch	Staggered Bond Pad Pitch	Standof Stitch Bonding Pad Pitch
In Production	14 nm	40 µm	25/50 µm	50 µm
In Development	<14 nm	35 µm	20/40 µm	40 µm

Feature	Ag-Alloy	Au	Au PCC
Wire Cost	Lower Cost	Expensive	Lowest Cost
FAB Hardness	Soft	Soft	Hard
Process Window	Wide	Wide	Narrow
AI Splash	Minimal	Minimal	More
Resistivity	Good	Better	Best

Property	Ag-Alloy	Au	Au PCC
Hardness (Hv) - EFO = 120 mA	50~60	44~49	70~80
Hardness (Hv) - HAZ	50~60	44~49	55~65
Hardness (Hv) - Wire	60~70	49~55	60~70
HAZ Length (µm)	60~80	60~80	80~100
Density (g/cm2)	10.58	19.2	8.98
Elastic Modulus (GPa)	60~70	80~90	90~100
Recrystallization Temp. (°C)	500~550	500~550	500~550
Melting Point (°C)	980~1010	1060~1080	1080~1100
Fusing Current (A, Length = 10 mm)	0.44	0.47	0.58
Resistivity (µΩ·cm) @ 20°C	3.3	2.9	1.9
Thermal Conductivity (W/m·K)	429	317	401
Coefficient of Thermal Expansion (×10-6/K)	19	14	17
Elongation (%)	2~12	2~7	3~17
Purity (%)	>95%	>99%	99.98