| Manufacturer | Part # | Datasheet | Description |
jb Capacitors Company
|
JFD |
344Kb/2P |
Non-inductive, plastic case and epoxy resin |
| JFN |
208Kb/2P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin |
| JFV |
494Kb/7P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin |
Suntan Capacitors
|
TS08V |
124Kb/1P |
NON ??INDUCTIVE, (UL940V-0) PLASTIC CASE SEALED WITH EPOXY RESIN |
jb Capacitors Company
|
JFO |
176Kb/1P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin |
| JFZ |
365Kb/3P |
Non-inductive, (UL940V-0) plastic case sealed with epoxy resin |
PHOENIX CONTACT
|
0803675 |
51Kb/2P |
Case - TMP CASE
09/11/2020 |
DISCO Corporation
|
MDTFR150-02 |
164Kb/1P |
Resin frame |
List of Unclassifed Man...
|
ER2220 |
308Kb/6P |
Epoxy Resin
02 February 2022 |
Kersemi Electronic Co.,...
|
AC10DSMA |
1Mb/5P |
Insulation type TRIAC fully covered with resin on the entire case other than electrode leads |
| AC08DSMA |
1Mb/5P |
Insulation type TRIAC fully covered with resin on the entire case other than electrode leads |
PHOENIX CONTACT
|
1229456 |
45Kb/1P |
Case - THERMOMARK GO CASE |
Kersemi Electronic Co.,...
|
AC12DSMA |
1Mb/5P |
Insulation type TRIAC fully covered with resin on the entire case other than electrode leads |
CTS Corporation
|
LA-A1 |
87Kb/2P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
| HP3 |
430Kb/6P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
| LA-B4 |
300Kb/2P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
| LB66B1 |
196Kb/2P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
PHOENIX CONTACT
|
2906272 |
50Kb/2P |
Transport case - PA-CASE 2
12/24/2021 |
CTS Corporation
|
HP1 |
541Kb/7P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
| LA-B3 |
221Kb/2P |
METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
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