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Part No. : LTSA-T680UBWT

BNS-OD-FC002/A4

SMD LED

LTSA-T680UBWT

7. Cautions

7.1 Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,

communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications

in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize

life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety

devices).

7.2 Storage

The package is sealed:

The LEDs should be stored at 30°C or less and 70%RH or less. And the LEDs are limited to use within one year, while

the LEDs is packed in moisture-proof package with the desiccants inside.

The package is opened:

The storage ambient for the LEDs should not exceed 30°C temperature and 60% relative humidity.

It is recommended that LEDs out of their original packaging are IR-reflowed within 168hrs.

For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container

with appropriate desiccant, or in a desiccators with nitrogen ambient.

LEDs stored out of their original packaging for more than 168hrs should be baked at about 60 °C for at least 48 hours

before solder assembly.

7.3 Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

7.4 Soldering

Recommended soldering conditions:

Reflow soldering

Soldering iron

Pre-heat

Pre-heat time

Peak temperature

Soldering time

150~200°C

120 sec. Max.

260°C Max.

10 sec. Max.(Max. two times)

Temperature

Soldering time

300°C Max.

3 sec. Max.

(one time only)

Notes:

Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit

boards, no single temperature profile works for all possible combinations.

However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific

characterization.

LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.

The results of this testing are verified through post-reflow reliability testing.Profiles used at LITE-ON are based on

JEDEC standards to ensure that all packages can be successfully and reliably surface mounted.

Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a

generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and

recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.