ATS-03F-19-C1-R0
AI

The **ATS-03F-19-C1-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "pushPIN™" family of thermal management components.
### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of this component:
| Specification | Details |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 54.00mm x 54.00mm x 20.00mm |
| **Attachment Type** | pushPIN™ (Spring-loaded pins) |
| **Pin Pitch** | 1.27mm (Standard for this series) |
| **Thermal Resistance** | 9.75°C/W (at 100 LFM) |
| **Weight** | ~40-50 grams (Estimated) |
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### 2. Key Components & Design Features
#### A. Fin Design (XC-Cut)
The "19" in the part number designates a specific fin pattern. This heat sink uses a **straight fin** or **cross-cut** design which allows for maximum surface area while maintaining low pressure drop, making it ideal for systems with forced air cooling.
#### B. PushPIN™ Attachment System
Instead of using messy thermal adhesives or complex screws, this part uses a standardized spring-pin mechanism:
* **Compression Springs:** Ensure consistent pressure is applied to the thermal interface material (TIM).
* **Brass/Plastic Pins:** Secure the heat sink directly into pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The "R0" suffix indicates that the heat sink typically comes with **pre-applied thermal interface material** (usually a high-performance phase-change material or grease). This ensures optimal heat transfer from the processor to the aluminum base without air gaps.
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### 3. Typical Applications
This electronic part is designed for cooling high-heat-generating components such as:
* **Processors (CPUs/GPUs):** For embedded systems or industrial PCs.
* **ASICs & FPGAs:** Used in networking hardware and telecommunications.
* **Power Electronics:** Cooling MOSFETs or power modules in high-density power supplies.
### 4. Part Number Breakdown (Decoder)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **03** | Attachment size/type |
| **F** | Aluminum material |
| **19** | Fin pattern/Height configuration |
| **C1** | Blue Anodized finish |
| **R0** | Standard packaging and pre-applied TIM |
- ⤷
What is the exact thermal resistance of this part at 400 LFM airflow?
- ⤷ What are the PCB hole size requirements for the pushPIN attachment?
- ⤷ Does this model support customization for different height requirements?