The **ATS-06C-42-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine Pitch (Cross-Cut) | | **Overall Dimensions** | 45mm x 45mm x 25mm | | **Mounting Pattern** | 38.0mm x 38.0mm | | **Thermal Resistance** | 7.30°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Design Elements #### A. Fin Pattern (Cross-Cut) The "Fine Pitch" design features vertical fins that are cut horizontally as well. This creates a grid of small pins or "stubs" which: * Increases the total surface area for heat dissipation. * Allows for multi-directional airflow, making it effective in systems where the air direction might be turbulent or non-linear. #### B. Mounting Mechanism (pushPIN™) This part utilizes a push-pin and brass spring mechanism. * **Benefits:** Ensures constant, uniform pressure on the electronic component (TIM - Thermal Interface Material), which optimizes heat transfer. * **Security:** It is more secure than adhesive tapes and easier to install than traditional screws. --- ### 3. Thermal Performance Data Performance varies based on the Velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :---: | :---: | :---: | :---: | | **Thermal Resistance (°C/W)** | 7.30 | 2.48 | 1.51 | 1.14 | --- ### 4. Typical Applications This specific heat sink is commonly found in: * **Telecommunications:** Cooling high-speed signal processors. * **Industrial PCs:** Maintaining stability in fanless or high-airflow enclosures. * **Embedded Systems:** Protecting chipsets from thermal throttling. ---