The **ATS-07F-85-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic systems. Below is a detailed breakdown of its specifications and characteristics. ### 1. General Specifications The part belongs to the **pushPIN™** series, which is characterized by its tool-free installation and reliable attachment mechanisms. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 22.98 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the physical constraints of a Printed Circuit Board (PCB). * **Length (A):** 35.00 mm * **Width (B):** 35.00 mm * **Height (C):** 10.00 mm (Low profile) * **Pitch (E/F):** 40.00 mm (Distance between attachment holes) --- ### 3. Thermal Performance Thermal resistance indicates how efficiently the heat sink moves heat away from the component. The performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.98 | | 200 (1.0 m/s) | 10.22 | | 300 (1.5 m/s) | 5.88 | | 400 (2.0 m/s) | 4.23 | --- ### 4. Key Design Features * **Fine Pitch Fin Pattern:** The "85" in the part number indicates a specific fin density. Fine pitch fins provide a larger surface area for heat dissipation in space-constrained environments. * **Push-Pin Attachment:** Uses a flexible, spring-loaded pin mechanism. This ensures constant pressure on the processor or component, improving thermal interface material (TIM) performance. * **Low Profile:** With a height of only 10mm, it is ideal for 1U servers or slim electronic enclosures where vertical space is limited. ### 5. Part Number Decoding The suffix **C2** refers to the thermal interface material and specific kit options: * **C2:** Typically indicates that the heat sink comes with **T766** thermal grease (or equivalent) pre-applied and uses a specific spring/pin material. * **R0:** Refers to the revision or packaging standard.