The **ATS-13F-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length/Width)** | 45.00 mm x 40.00 mm | | **Height** | 20.00 mm (Low profile) | | **Thermal Resistance** | 3.90°C/W @ 100 LFM (Airflow) | | **Color/Finish** | Blue Anodized | --- ### 2. Core Electronic Components & Design The "parts" of this assembly are engineered to optimize heat dissipation from a semiconductor to the ambient air: #### A. The Heat Sink Body * **Material:** Made from high-grade aluminum. Aluminum is chosen for its high thermal conductivity and light weight. * **Fin Design:** It uses a high-aspect-ratio "fluted" fin pattern. This design increases the surface area significantly, allowing more heat to be carried away by moving air. #### B. pushPIN™ Attachment System Instead of simple adhesives, this part uses a mechanical attachment system: * **Steel Springs:** Provide a precise, consistent "Pre-Load" pressure between the chip and the heat sink. * **Plastic/Brass Pins:** Insert into pre-drilled holes on the PCB to lock the assembly in place securely. #### C. Thermal Interface Material (TIM) * **Pre-Applied Coating:** This specific part usually comes with **T766** thermal phase-change material or a high-performance thermal pad pre-applied to the base. * **Function:** It fills microscopic air gaps between the electronic chip (CPU/GPU/FPGA) and the aluminum base to ensure maximum heat transfer. --- ### 3. Usage Context This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processors in switches or routers. 2. **Embedded Computing:** Managing heat in industrial PCs. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. --- ### 4. Part Number Breakdown (Nomenclature) ```text ATS - 13 F - 69 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Finish/Color (Blue Anodized) | | +------------ Series/Specific Configuration | +----------------- Fin Attachment Type +----------------------- Advanced Thermal Solutions ```