ATS-18B-75-C3-R0
AI

The **ATS-18B-75-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*, designed for cooling integrated circuits (ICs) and other electronic components.
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### Technical Specifications
The following table summarizes the key physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Attachment Type** | Push Pin (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 1.33°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 30mm |
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### Key Electronic Components & Features
The "ATS-18B-75-C3-R0" is not a powered device itself, but an essential mechanical-electronic interface part. Its design includes several critical sub-components:
#### 1. Heat Sink Body (Aluminum)
The body is designed with a **fine-pitch fin structure**. This maximizes the surface area to allow heat to transfer from the electronic component (like a CPU, GPU, or FPGA) into the surrounding air.
#### 2. pushPIN™ Attachment System
Instead of using messy adhesives or permanent solder, this part uses a **Push Pin mechanism**.
* **Springs:** Provide consistent pressure (Force) to ensure the heat sink remains in perfect contact with the electronic chip.
* **Pins:** Designed to fit into pre-drilled holes in the Printed Circuit Board (PCB).
#### 3. Thermal Interface Material (TIM)
The "R0" at the end of the part number usually signifies that a **Thermal Interface Material** (like a pre-applied thermal pad or phase-change material) is included. This fills the microscopic air gaps between the chip and the heat sink to improve heat conduction.
#### 4. Blue Anodized Finish
The blue coating is not just for aesthetics; it provides **corrosion resistance** and improves the emissivity of the surface, slightly enhancing radiant heat transfer.
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### Applications in Electronics
This specific heat sink is commonly used for:
* **Networking Equipment:** Routers, switches, and gateways.
* **Industrial PCs:** High-heat environments where active fans might fail.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
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What are the different types of Push Pin materials available for this heat sink?
- ⤷ How does the 'C3' designation in the part number affect the thermal performance?
- ⤷ Can this heat sink be used with a cooling fan for active thermal management?