ATS-P2-160-C2-R0
AI

## Electronic Part Analysis: ATS-P2-160-C2-R0
The **ATS-P2-160-C2-R0** is a high-performance **Heat Sink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management series, designed to cool electronic components like CPUs, GPUs, and other high-power ICs.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Body), Copper (Thermal Interface) |
| **Attachment Type** | Push Pin (Plastic/Brass) |
| **Fin Style** | Straight Fin |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | ~1.58 °C/W (at 200 LFM) |
| **Finish** | Blue Anodized |
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### 2. Design and Components
#### A. Thermal Performance
The "C2" in the part number indicates a specific thermal profile. The straight-fin design is optimized for **forced air-flow** (ducted or open) environments. The blue anodized coating not only provides corrosion resistance but also improves emissivity for radiative cooling.
#### B. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system:
* **Compression Springs:** Provide precise pressure across the component to ensure maximum heat transfer.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Thermal Interface Material (TIM)
This specific model usually comes with **T766** pre-applied thermal phase-change material or a high-performance grease, ensuring there are no air gaps between the heat sink and the electronic chip.
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### 3. Application Use Cases
* **Embedded Systems:** High-heat processors in industrial controllers.
* **Telecommunications:** Cooling for ASICs in networking switches and routers.
* **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **P2** | pushPIN™ Series |
| **160** | Specific thermal/geometric configuration code |
| **C2** | Thermal performance/Material grade |
| **R0** | RoHS Compliant / Revision code |
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- ⤷
What are the PCB hole diameter requirements for the ATS-P2-160-C2-R0 push pins?
- ⤷ How does the thermal resistance of this heat sink change under passive vs. forced air cooling?
- ⤷ Are there alternative mounting options if my PCB does not have pre-drilled holes?