The **ATS-P2-74-C3-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a pin-fin heat sink designed for cooling surface-mount electronics like BGA (Ball Grid Array) components. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Heat Sink Type** | Push-Pin (Pin-Fin) | | **Attachment Method** | Push-Pin with Springs | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 35mm | | **Thermal Resistance** | 2.03 °C/W (at 200 LFM) | | **Regulatory Compliance** | RoHS Compliant | --- ### 2. Key Component Features #### A. Pin-Fin Design Unlike traditional straight-fin heat sinks, the pin-fin geometry increases the surface area and creates turbulence in the airflow. This allows for superior cooling in environments where the direction of airflow might be inconsistent or multidirectional. #### B. Push-Pin Attachment Mechanism The "P2" in the part number indicates the specific push-pin mounting style. * **Ease of Assembly:** Provides a secure, mechanical attachment to the PCB without the need for adhesives. * **Constant Pressure:** The integrated springs ensure consistent contact pressure between the heat sink and the electronic component, optimizing heat transfer. #### C. High Aspect Ratio With a height of 35mm on a small 25mm base, this heat sink is designed for applications where vertical space is available but PCB real estate is limited. --- ### 3. Applications and Usage This part is typically used in industrial and telecommunications hardware, such as: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. * **Power Supplies:** Dissipating heat from high-performance transistors. --- ### 4. Thermal Performance Data Performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 8.90 | | **200 LFM** | 2.03 | | **400 LFM** | 1.45 | | **600 LFM** | 1.22 |