The **ATS-P2-79-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2-Pin) | | **Thermal Resistance** | 26.32°C/W (Natural Convection) | | **Flow Type** | High Flow / Low Pressure Drop | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 20.00mm | --- ### 2. Key Components & Design Features #### A. Fin Design: pushPIN™ This part utilizes the **straight-fin** or **cross-cut** design (depending on the specific sub-revision) optimized for air cooling. The goal is to maximize surface area while maintaining a low profile to fit into compact electronic enclosures. #### B. Attachment Mechanism (R0) The "R0" suffix indicates the specific mounting hardware. This model uses **brass or plastic push-pins** with a compression spring. * **Benefits:** Provides consistent pressure (7-10 lbs/sq inch) across the component, ensuring optimal contact with the Thermal Interface Material (TIM). * **Stability:** Securely holds the heat sink in place during shock or vibration. #### C. Thermal Interface Material (TIM) The base of the heat sink usually comes pre-applied with a high-performance thermal pad or grease. This fills microscopic air gaps between the heat sink and the electronic chip, facilitating efficient heat transfer. --- ### 3. Application Use Cases The ATS-P2-79-C1-R0 is typically used for the following electronic parts: 1. **BGA Components:** Common in networking equipment (routers, switches). 2. **CPUs/GPUs:** Small-scale processors in embedded systems. 3. **Power Management ICs:** High-voltage regulators that generate significant heat. 4. **FPGA/ASIC:** Field Programmable Gate Arrays that require stable thermal environments for logic processing. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 26.32 | | 200 | 1.0 | 11.69 | | 400 | 2.0 | 7.07 | | 600 | 3.0 | 5.30 |