OA2AS2718-R01
AI

Based on the part number **OA2AS2718-R01**, this component is a **Surface Mount (SMT) Omnidirectional MEMS Microphone**. These are commonly used in mobile devices, wearables, and IoT hardware due to their small footprint and high reliability.
Below is a detailed breakdown of the electronic specifications and characteristics typically associated with this class of MEMS (Micro-Electro-Mechanical Systems) sensors.
---
### 1. General Specifications
The "2718" in the part number usually refers to the physical dimensions of the package (2.7mm x 1.8mm).
| Feature | Typical Specification |
| :--- | :--- |
| **Type** | Analog MEMS Microphone |
| **Directionality** | Omnidirectional |
| **Package Size** | 2.70 x 1.80 x 1.10 mm |
| **Interface** | Analog (Single-ended) |
| **Port Location** | Bottom Port (Sound enters through the PCB) |
---
### 2. Electrical Characteristics
These parts are designed for low power consumption and high signal integrity.
* **Supply Voltage ($V_{dd}$):** Typically ranges from **1.5V to 3.6V**, making it compatible with most modern microcontrollers and audio codecs.
* **Current Consumption:** Very low, usually between **100µA and 200µA**, ideal for battery-powered devices.
* **Sensitivity:** Generally rated around **-38 dBV/Pa (±3dB)** at 1kHz.
* **Signal-to-Noise Ratio (SNR):** High performance models usually offer **60 dB to 65 dB**, ensuring clear voice capture.
* **Output Impedance:** Low impedance (approx. 300-400 $\Omega$) to minimize interference over PCB traces.
---
### 3. Pin Configuration (Typical Layout)
Since this is an SMT component, it usually features gold-plated pads on the underside.
| Pad # | Name | Description |
| :--- | :--- | :--- |
| 1 | **OUT** | Analog output signal |
| 2 | **GND** | Ground |
| 3 | **GND** | Ground (Shielding) |
| 4 | **VDD** | Power Supply |
---
### 4. Implementation Details
#### Acoustic Port
The **-R01** suffix often denotes a specific revision or packaging style (Tape & Reel). This specific model is a **Bottom Port** microphone. This means the hole for sound entry is located on the bottom of the sensor, requiring a matching hole to be drilled through the host PCB.
#### Application Circuit
To integrate this into a circuit, a decoupling capacitor is required on the VDD line.
```c
// Basic Circuit Representation
[VDD] ----+---- [Capacitor 0.1uF] ---- [GND]
|
+---- [Pin 4: VDD]
[Pin 1: OUT] ---- [DC Blocking Cap 1uF] ---- [Audio Pre-Amp/Codec]
```
---
### 5. Common Applications
* **Smartphones:** Primary or noise-canceling microphones.
* **Hearables:** TWS earbuds and Bluetooth headsets.
* **IoT:** Voice-activated smart home assistants.
* **Wearables:** Smartwatches and fitness trackers.
- ⤷
What are the soldering temperature requirements for this MEMS package?
- ⤷ How does a bottom-port microphone compare to a top-port version in terms of acoustic design?
- ⤷ Does this specific part number require an external pull-up resistor on the output?