# CSOIC Ceramic Small Outline Integrated Circuit Package

## Description
️· Ceramic version of the Plastic SOIC package.
️· Hermetic package consisting of a multilayer ceramic surrounding a "gullwing" leadframe.
️· Leads extend from two sides of the package (dual).
️· Hermetically solder sealed at 325° Centigrade.
️· Designed for Surface Mount Technology (SMT) processes.

## Features
️· Lead Count: 28 (other counts available)
️· Body Size: 300 mil
️· Hermetic Solder Seal
️· High Thermal Conductive Ceramic
️· Gold Lead Finish
️· "Gullwing" Lead Form
️· Compliant with JEDEC and EIAJ package outline standards
️· Wide selection of cavity sizes available
️· Commercial or full Military flows available

## Applications
️· Consumer electronics (audio, video, entertainment)
️· Telecommunications (pagers, cordless phones)
️· RF/Wireless applications (PC cards, RF/CATV, telemetry)
️· Office equipment (fax, copier, printer)
️· PC/Peripheral devices
️· Automotive applications
️· Suitable for resistor networks, discrete semiconductors, and ICs.

## Website
️· www.amkor.com