data sheet

CSOIC

Features:

CERAMIC

www.amkor.com

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

Ceramic Small Outline

Integrated Circuit Package

(CSOIC)

This is a ceramic version of the Plastic SOIC

package. The CSOIC is a hermetic package

consisting of a multilayer ceramic surrounding a

"gullwing" formed leadframe. This package has

leads extending from two sides of the package

(dual). The package is hermetically solder sealed

at 325° Centigrade. These IC packages have

proven surface mount (SMT) performance

characteristics and have been designed to adapt

easily to ALL SMT processes and lines. Ceramic

SOIC packages provide component and packaging

engineers the ability and freedom to optimize

systems and product designs.

Applications:

End products range from consumer (audio, video,

and entertainment), telecom (pagers, cordless

telephone), RF/wireless (PC cards, RF/CATV,

telemetry), office (fax, copier, and printer),

PC/peripheral, automotive and other applications.

Whether you're working with resistor networks,

discrete semiconductors or ICs, CSOIC package

product lines will serve the needs of various

semiconductor technologies with ease.

The CSOIC offers a variety of features:

• 28 lead count (Others available if supplied

and tooled)

• 300 mil body size

• Hermetic solder sealed package

• High thermal conductive ceramic

• Gold lead finish

• "Gullwing" lead form

• JEDEC and EIAJ package outline standard

compliant

• Wide selection of cavity sizes to meet most

die size needs

• Commercial or full Military flows

DS807

Rev Date: 08’02

.