Features
 RDS(ON), VGS@10V, ID@8A<9.5mΩ
 RDS(ON), VGS@4.5V, ID@4A<14mΩ
 High switching speed
 Improved dv/dt capability
 Low Gate Charge
 Low reverse transfer capacitance
 Lead free in compliance with EU RoHS 2.0
 Green molding compound as per IEC 61249 standard
Mechanical Data
 Case: SOP-8 package
 Terminals: Solderable per MIL-STD-750, Method 2026
 Approx. Weight: 0.0029 ounces, 0.083 grams