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33662 Datasheet (PDF) - NXP Semiconductors

33662 Datasheet PDF - NXP Semiconductors
Part # 33662
Download  33662 Download
File Size   774.19 Kbytes
Page   31 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description ISO 17987/LIN 2.x/SAEJ2602-2 LIN Physical Layer

33662 Datasheet (PDF)

Go To PDF Page Download Datasheet
33662 Datasheet PDF - NXP Semiconductors

Part # 33662
Download  33662 Click to download

File Size   774.19 Kbytes
Page   31 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description ISO 17987/LIN 2.x/SAEJ2602-2 LIN Physical Layer

33662 Datasheet (HTML) - NXP Semiconductors


33662 Product details

The Local Interconnect Network (LIN) is a serial communication
protocol, designed to support automotive networks in conjunction with
a Controller Area Network (CAN). As the lowest level of a hierarchical
network, LIN enables cost-effective communication with sensors and
actuators when all the features of CAN are not required.
The three 33662 versions are designed to operate at different
maximum baud rates. The 33662LEF and 33662BLEF, and the
33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and
the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They
integrate a fast baud rate (above 100 kbps), as reported by the RXD pin
for test and programming modes. They provide excellent EMC
(Electromagnetic Compatibility) and Radiated Emission performance,
ESD (Electrostatic Discharge) robustness, and safe behavior, in the
event of a LIN bus short-to-ground, or a LIN bus leakage during lowpower
mode. This device is powered by SMARTMOS technology.

Features
•Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
•Compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602and ISO 17987-4:2016 (12 V)Active bus wave shaping, offering excellent radiated emissionperformance
•Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
•Very high immunity against electromagnetic interference
•Low standby current in Sleep mode
•Overtemperature protection
•Local and remote Wake-up capability reported by the RXD pin
•Fast baud rate selection reported by RXD pin
•5.0 V and 3.3 V compatible digital inputs without any requiredexternal components
•Pin-to-pin compatible with TJA1021

Applications
•Automotive Market:
•Body electronics (BCM, gateway, roof, door,lighting, HVAC)
•Powertrain (EMS, start & stop), BMS
•Safety & Chassis (TPMS, seat belt)




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About NXP Semiconductors


NXP Semiconductors is a publicly traded multinational company that designs, develops, and manufactures a wide range of semiconductors and integrated circuits for various applications, including automotive, industrial, communications, and consumer markets.

The company was founded in 2006 and is headquartered in Eindhoven, Netherlands.

NXP offers a broad portfolio of products, including microcontrollers, microprocessors, secure authentication ICs, power management ICs, RF and microwave components, and sensor solutions, among others.

The company's products are designed to be energy efficient, secure, and reliable, and are used in a variety of applications, including automotive systems, industrial automation and control, smart homes and buildings, and connected devices.

NXP is dedicated to innovation and customer satisfaction, and is committed to providing its customers with the best semiconductor solutions to meet their needs.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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