FEATURES
■ High temperature thermoplastic material
■ Customizable height
■ Blank 0.64mm square contacts present 4 surfaces of equal
quality
■ Standoff design
■ Duplex plating
■ Tin-lead plating in press-fit area
■ Press-fit designed to fit 1.02mm diameter hole, solder-toboard products
■ Meets DIN 41651 specification, HE 13, and BT D2632

BENEFITS
■ Re-flow compatible
■ Cater to a wide range of applications
■ Suitable for mezzanine application and gives more flexibility
in meeting different stack height requirements
■ Can be used for wire wrapping
■ Allows cleaning to remove soldering contamination
■ Cost efficient
■ Easy pin insertion onto PCB
■ High retention force onto PCB
■ Same layout on THT and press-fit
■ Qualified product