DESCRIPTION
Non-activated liquid flux according to DIN EN 29454-1 type 1.1.1 and EN 61190-1-1 type ROL0. Non-corrosive flux residues.
Stannol 300-25 also meets requirements for test-flux (DIN) IEC 68 -2 - 20 6.6.1.
Stannol 300-25 is a ready for use no clean flux for wave and drag soldering. It was developed for use in electric and
electronic soldering of PCBs and other purposes.
It does not contain any activators or other additives which can cause ionic contamination. This flux is used where highest
requirements exist on corrosion resistance and security. Because of the high activity level of the flux, bridge and icicle
formation is reduced to a minimum.
Stannol 300-25 has good wetting properties on clean and good solderable surfaces. Post soldering residues are solid, dry,
transparent and safe.
APPLICATION
Stannol 300-25 is suitable for all methods of application like brushing, dipping, spray and foam. Most of the flux solids were
purged during the process, but remaining residues may remain on the PCB. If cleaning is required it can be done either with
organic solvents like alcohols and glycol ethers or saponifying agents.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.