| Manufacturer | Part # | Datasheet | Description |
 Samsung semiconductor |
K4S640432H-TC
|
144Kb / 14P |
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free
|
|
K4S560432E-UC
|
198Kb / 14P |
256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant)
|
 PIC GmbH |
MS-104-3
|
113Kb / 2P |
Micro Reed Sensor pitch 10.16 mm
|
 OSRAM GmbH |
LS-Q976
|
517Kb / 19P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LG-Q971
|
418Kb / 21P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LS-Q971
|
211Kb / 20P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
 Lite-On Technology Corp... |
LTS-4610AE
|
119Kb / 5P |
0.4 inch (10.16 mm) DIGIT HEIGHT
|
|
LTS-4710AP
|
135Kb / 5P |
0.4 inch (10.16 mm) DIGIT HEIGHT
|
 List of Unclassifed Man... |
HDRA
|
1Mb / 30P |
0.8 mm Pitch Connectors
|
 FIBOX Enclosing innovat... |
5070729
|
46Kb / 1P |
Spacer 54 mm
31.07.2023 |