ISL12058 datasheet(4/20 Pages) RENESAS

4 / 20 page

ISL12058

FN6756 Rev 1.00

Page 4 of 20

Dec 10, 2015

Absolute Maximum Ratings

Thermal Information

Voltage on VDD Pin (respect to GND) . . . . . . . . . . . . . . . -0.2V to 4V

Voltage on IRQ/FOUT , SCL and SDA Pins

(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V

Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V

ESD Rating ((Per MIL-STD-883 Method 3014)

Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV

Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V

Thermal Resistance (Typical)

JA (°C/W) JC (°C/W)

8 Lead SOIC (Note 3) . . . . . . . . . . . . .

120

N/A

8 Lead MSOP (Note 3). . . . . . . . . . . . .

169

N/A

8 Lead µTDFN (Note 3) . . . . . . . . . . . .

160

N/A

8 Lead TDFN (Notes 4, 5) . . . . . . . . . .

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTES:

JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

5. For

JC, the “case temp” location is the center of the exposed metal pad on the package underside.

DC Operating Characteristics – RTC Temperature = -40°C to +85°C unless otherwise stated.

SYMBOL

PARAMETER

CONDITIONS

MIN

(Note 8)

TYP

(Note 7)

MAX

(Note 8)

UNITS

NOTES

VDD

Main Power Supply

1.8

3.6

VDDT

Timekeeping Power Supply

1.4

1.8

IDD1

Standby Supply Current

VDD = 3.6V

600

950

6, 12

VDD = 3.0V

500

IDD2

Timekeeping Current

VDD = 1.8V

400

650

6, 12

VDD = 1.4V

350

IDD3

Supply Current With I2C Active at

Clock Speed of 400kHz

VDD = 3.6V

µA

ILI

Input Leakage Current on SCL

-100

100

ILO

I/O Leakage Current on SDA

-100

100

IRQ/FOUT

VOL

Output Low Voltage

VDD = 1.8V, IOL = 3mA

0.4

Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

(Note 8)

TYP (Note 7)

MAX

(Note 8)

UNITS NOTES

SERIAL INTERFACE SPECS

VIL

SDA and SCL Input Buffer LOW

Voltage

-0.3

0.3 x VDD

VIH

SDA and SCL Input Buffer HIGH

Voltage

0.7 x VDD

5.5

Hysteresis SDA and SCL Input Buffer

Hysteresis

0.04 x VDD

VPULLUP Maximum Pull-up Voltage on SDA

during I2C Communication

VDD + 2

VOL

SDA Output Buffer LOW Voltage,

Sinking 3mA

VDD > 1.8V, VPULLUP = 5.0V

0.4

Cpin

SDA and SCL Pin Capacitance

TA = +25°C, f = 1MHz, VDD = 5V,

VIN = 0V, VOUT = 0V

9, 10

fSCL

SCL Frequency

400

kHz

ISL12058

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