date 05/11/2017

page 1 of 3

cui.com

MODEL: HSE-B20250-045H

│ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• placement pins for secure PCB mounting

• round hole for component attachment

• black anodized finish

MODEL

power

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSE-B20250-045H

9.74

12.29

4.05

2.84

7.70

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

Without Airflow

200 LFM

400 LFM

0

10

20

30

40

50

60

70

80

90

100

01

23

45

Dissipated Power (W)

67

89

10

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

Power

(W)

Natural

Conv.

200 LFM

400 LFM

0

0

0

0

1

12.29

4.05

2.84

2

23.82

7.75

6.41

3

34.26

11.31

9.58

4

44.14

15.68

12.55

5

53.47

19.34

16.03

6

62.05

22.49

18.96

7

70.15

26.38

21.56

8

77.35

30.60

25.15

9

84.60

34.29

28.46

10

90.94

37.71

31.61

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

For more information, please visit the product page.