date 05/04/2017

page 1 of 4

cui.com

SERIES: HSE-BX-040H

│ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• placement pins for secure PCB attachment

• round hole for component attachment

• multiple available cut lengths

MODEL

power

length

(mm)

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSE-B20254-040H

25.4

13.16

16.13

7.74

5.77

5.70

HSE-B20381-040H

38.1

11.54

12.28

3.62

2.88

6.50

Note:

1. See performance curves for full thermal resistance details.

2. Custom cut to length options available. Thermal data not available on custom lengths.

PERFORMANCE CURVES

0

10

20

30

40

50

60

70

80

90

100

01

23

45

Dissipated Power (W)

67

89

10

Without Airflow

200 LFM

400 LFM

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

Power

(W)

Natural

Conv.

200 LFM

400 LFM

0

0

0

0

1

16.13

7.74

5.77

2

29.25

15.62

11.53

3

42.80

23.81

17.04

4

55.72

31.68

22.66

5

67.84

39.53

28.21

6

78.06

47.35

33.83

7

88.34

54.42

39.65

8

97.77

62.21

45.28

9

107.55

69.81

50.42

10

117.33

77.16

56.11

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

HSE-B20254-040H

For more information, please visit the product page.