date 09/07/2017

page 1 of 5

cui.com

SERIES: HSE-BX-045H

│ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• placement pins for secure PCB attachment

• round hole for component attachment

• multiple available cut lengths

MODEL

power

length

(mm)

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSE-B254-045H

25.4

11.72

16.12

3.86

2.52

6.40

HSE-B381-045H

38.1

7.58

8.52

2.63

1.82

9.90

HSE-B508-045H

50.8

8.06

10.52

4.38

2.89

9.30

HSE-B635-045H

63.5

6.41

7.99

3.53

2.49

11.70

Note:

1. See performance curves for full thermal resistance details.

2. Custom cut to length options available. Thermal data not available on custom lengths.

PERFORMANCE CURVES

0

10

20

30

40

50

60

70

80

90

100

01

23

45

Dissipated Power (W)

Without Airflow

200 LFM

400 LFM

6789

10

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

Power

(W)

Natural

Conv.

200 LFM

400 LFM

0

0

0

0

1

16.12

3.86

2.52

2

29.41

8.30

5.68

3

40.00

12.22

9.31

4

51.44

16.39

12.14

5

61.45

20.66

15.34

6

72.61

24.92

18.41

7

80.92

28.68

20.86

8

90.03

33.22

23.73

9

96.81

37.23

26.92

10

105.60

41.07

30.04

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

HSE-B254-045H

For more information, please visit the product page.