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Die Size (Unsawn)

330 x 330

12.99 x 12.99

µm

mils

Anode Pad Size

235 x 235

9.25 x 9.25

µm

mils

Die Thickness

200

7.87

µm

mils

Top Metal Composition

Al

Back Metal Composition

AuAs

 

0.5W Zener Diode ‐ 1N52*D series  

Silicon Planar Zener diode in bare die form – 1% tolerance

Sharp Reverse Characteristics

Low Reverse Current Levels

High Reliability Gold Back Metal

High Reliability tested grades.

Rev 1.1

05/04/19

Features:

Die Dimensions in µm (mils)

330 (12.99)

CHIP BACKSIDE IS CATHODE

Ordering Information

The following part suffixes apply:

No suffix - Commercial grade die

“H”– Hi-rel grade die + MIL-STD-38534 Class H LAT

“K” – Hi-rel grade die + MIL-STD-38534 Class K LAT.

LAT = Lot acceptance Test.

For information on Hi-Rel LAT flows please see below.

www.siliconsupplies.com\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – By specific request

Unsawn Wafer – By specific request

With additional electrical selection – By specific request

235 (9.25)

ANODE