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PL331BIDBVR Datasheet(PDF) 4 Page - Texas Instruments |
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PL331BIDBVR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 21 page ![]() 4 TL331, TL331B, TL391B SLVS238H – AUGUST 1999 – REVISED MAY 2020 www.ti.com Product Folder Links: TL331 TL331B TL391B Submit Documentation Feedback Copyright © 1999–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input current is removed. 6 Specifications 6.1 Absolute Maximum Ratings, TL331 and TL331K over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 0 36 V VID Differential input voltage(3) –36 36 V VI Input voltage range (either input) –0.3 36 V VO Output voltage 0 36 V IO Output current 0 20 mA Duration of output short-circuit to ground(4) Unlimited IIK Input current(5) –50 mA TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input current is removed. 6.2 Absolute Maximum Ratings, TL331B and TL391B over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) -0.3 38 V VID Differential input voltage(3) –38 38 V VI Input voltage range (either input) –0.3 38 V VO Output voltage -0.3 38 V IO Output current 20 mA Duration of output short-circuit to ground(4) Unlimited IIK Input current(5) –50 mA TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 ESD Ratings, TL331 and TL331K VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750 |
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