3

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2011

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size (

µm)

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

opening (

µm)

900 x 1150

150 µm

111

70 x 70

Pad Number

Pad Name

Description

Pin Coordinates (µm)

A

VM

Common Receive Switch

Control Voltage

99, 576

B

VRX4

RX4 Control Voltage

98, 919

C

VTX2

TX2 Control Voltage

98, 805

D

VRX3

RX3 Control Voltage

98, 689

E

VRX1

RX1 Control Voltage

103, 230

F

VRX2

RX2 Control Voltage

98, 459

G

VTX1

TX1 Control Voltage

105, 347

H

TX2

TX2 RF Output

130, 1037

I

TX1

TX1 RF Output

127, 114

J

ANT

Antenna

509, 958

K

RX4

RX4 RF Output

779, 1056

L

RX3

RX3 RF Output

779, 856

M

RX2

RX2 RF Output

779, 302

N

RX1

RX1 RF Output

779, 101

O

GND

Ground 1

605, 141

P

GND

Ground 1

620, 959

Q

GND

Ground RXC

777, 511

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q