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LSF0102DDFR Datasheet(PDF) 46 Page - Texas Instruments |
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LSF0102DDFR Datasheet(HTML) 46 Page - Texas Instruments |
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46 / 57 page  www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 20X (0.6) 20X (0.24) 16X (0.5) (4.3) (2.3) (R0.05) TYP (1.25) ( 0.2) VIA TYP (1) (3) VQFN - 1 mm max height RKS0020A PLASTIC QUAD FLATPACK - NO LEAD 4222490/B 02/2021 SYMM 1 12 9 10 11 2 19 20 SYMM LAND PATTERN EXAMPLE SCALE:20X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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