D2V5F4U8MR

Document number: DS43659 Rev. 2 - 2

2 of 5

www.diodes.com

November 2022

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D2V5F4U8MR

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Conditions

Peak Pulse Power Dissipation

PPP

1000

W

8/20µs, per Figure 1

Peak Pulse Current

IPP

80

A

8/20µs, per Figure 1

ESD Protection

– Contact Discharge

VESD_Contact

±8

kV

IEC 61000-4-2 Standard

ESD Protection

– Air Discharge

VESD_Air

±15

kV

IEC 61000-4-2 Standard

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Package Power Dissipation (Note 5)

PD

500

mW

Thermal Resistance, Junction to Ambient (Note 5)

RJA

50.12

C/W

Operating Temperature Range

TJ

-55 to +125

C

Storage Temperature Range

TSTG

-55 to +150

C

Soldering Temperature, t max = 10s

TL

+260

C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Standoff Voltage

VRWM

—

—

2.5

V

—

Channel Leakage Current (Note 6)

IRM

—

—

1

µA

VRWM = 2.5V

Punch Through Voltage

VPT

2.7

—

—

V

IPT = 2µA

Snap-Back Voltage

VSB

2.5

—

—

ISB = 50mA

Clamping Voltage, Positive Transients

VCL

—

—

5

V

IPP = 1A, tp = 8/20μs, Figure 1

—

—

17

IPP = 48A, tp = 8/20μs, Figure 1

—

—

20

IPP = 80A, tp = 8/20μs, Figure 1

Channel Input Capacitance

CT

—

2.1

3

pF

VR = 0V, f = 1MHz, each line

Notes:

5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on our website at http://www.diodes.com/package-outlines.html.

6. Short duration pulse test used to minimize self-heating effect.

80

40

20

0

t, TIME (

祍 )

Figure 1 Pulse Waveform

100

50

0

t = 8

祍

r

Peak Value I

PP

Half Value I

PP/2

8x20 Waveform

as defined by R.E.A.

tp

-10

0

10

20 30

40

50

60

70

80

90 100

TIME (ns)

Figure 2 ESD Discharge Current Wave Form

IEC 6100-4-2 (330 /150pF)



Rise time = 0.7ns to 1ns

0

20

40

60

80

100

120

27

53

(

μs)

8

μs

IEC 61000-4-2

tr,

Figure 1.

Figure 2.