( P100°CRated temp.

)

Stability<0.5%

180

160

140

120

100

80

60

40

20

0

0

20

40

60

80

100

120

175

150

125

100

75

50

25

0

-25

-50

-75

0

20

40

60

80

100

120

°C

0

7

1

°C

0

7

°C

5

6

-

Derating curve(Ambient temp.)

Ambient temperature°C

Terminal temperature°C

Stability<1.0%

( P70℃ Rated temp.
)

Derating curve(Terminal temp.)

Performance

MIL-STD-202 Method 108

MIL-STD-202 Method 106

MIL-STD-202 Method 108

J-STD-202

MIL-STD-202 Method 210

MIL-STD-202 Method 201

MIL-STD-202 Method 103

Test ltem

T=24h/cycle,no load,7a and 7b not required,measured 24±2h after test

Short-time overload

High temp. storage

Moisture resistance

Load life

Resistance to soldering heat

High temp. & high humidity

Thermal shock

Solderability

Test Method

Standard

5x rated power for 5s,measured 24±2h after test

+170°C,1000h,no load,measured 24±2h after test

+70°C,2000h,rated power,measured 24±2h after test

+260°C±5°C,10s±1s,measured 24±2h after test

+85°C,85%RH,10% of rated power,1000h,measured 24±2h after test

+235°C±5°C,2s±0.5s

95% coverd

-55°C~+125°C,1000 cycles,measured 24±2h after test

JESD22 Method JA-104

±0.1%

±0.2%

±0.02%

±0.2%

±0.05%

±0.1%

±0.05%

±0.3%

±0.5%

±0.05%

±0.5%

±0.3%

±0.5%

±0.3%

Datasheet no. E05014

Ver V0

Date 2022/7/28

No.：

E16015














Version：

V0

Date：

2023/02/14

C&B Electronics Shenzhen Co.,Ltd
|

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