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B
BR
RIIG
GH
HT
T L
LE
ED
D E
EL
LE
EC
CT
TR
RO
ON
NIIC
CS
S C
CO
OR
RP
P..
B
BL
L--R
R2
21
13
32
2N
N
Ver.1.0 Page: 1 of 2
SINCE 1981
5.0(.197)
0.5(.02)
SQ. TYP.
NOM.
2.54(.10)
1.5(.059)
MAX.
25.4(1.0) MIN.
7.0(.276)
1.0(.039) MIN.
1.9(.075)
5.05(.198)
2.0(.079)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Features:
● Package dimensions
1. Chip material: GaP /GaP
2. Emitted color : Green
3. Lens Appearance : Green Diffused
4. Low power consumption.
5. Most suitable for use like level indicator.
6. Excellent uniformity of light emittance.
7. Long life solid state reliability.
8. Compatible.
9. This product don’t contained restriction
substance, compliance ROHS standard.
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
● Absolute maximum ratings(Ta=25℃)
Parameter
Symbol
Rating
Unit
Power Dissipation
Pd
80
mW
Forward Current
IF
30
mA
Peak Forward Current*1
IFP
150
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40℃~80℃
Storage Temperature
Tstg
-40℃~85℃
Soldering Temperature
Tsol
260℃(for 5 seconds)
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.
1.1
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