PACKAGE OPTION ADDENDUM

www.ti.com

23-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

CY74FCT652ATQCT

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652A

CY74FCT652ATQCT.B

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652A

CY74FCT652ATSOC

Active

Production

SOIC (DW) | 24

25 | TUBE

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT652A

CY74FCT652ATSOC.B

Active

Production

SOIC (DW) | 24

25 | TUBE

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT652A

CY74FCT652ATSOCT

Active

Production

SOIC (DW) | 24

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT652A

CY74FCT652ATSOCT.B

Active

Production

SOIC (DW) | 24

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT652A

CY74FCT652CTQCT

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652C

CY74FCT652CTQCT.B

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652C

CY74FCT652CTQCTG4.B

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652C

CY74FCT652CTSOCT

Active

Production

SOIC (DW) | 24

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT652C

CY74FCT652CTSOCT.B

Active

Production

SOIC (DW) | 24

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT652C

CY74FCT652TQCT

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652

CY74FCT652TQCT.B

Active

Production

SSOP (DBQ) | 24

2500 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT652

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Addendum-Page 1