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LMV641

SNOSAW3D – SEPTEMBER 2007 – REVISED AUGUST 2016

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Copyright © 2007–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ..................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

DC Electrical Characteristics: 2.7 V ......................... 5

6.6

DC Electrical Characteristics: 10 V ........................... 6

6.7

Typical Characteristics .............................................. 8

7

Detailed Description ............................................ 14

7.1

Overview ................................................................. 14

7.2

Functional Block Diagram ....................................... 14

7.3

Feature Description................................................. 14

7.4

Device Functional Modes........................................ 15

8

Application and Implementation ........................ 17

8.1

Application Information............................................ 17

8.2

Typical Applications ................................................ 17

9

Power Supply Recommendations ...................... 23

10

Layout................................................................... 23

10.1

Layout Guidelines ................................................. 23

10.2

Layout Example .................................................... 23

11

Device and Documentation Support ................. 24

11.1

Device Support .................................................... 24

11.2

Documentation Support ....................................... 24

11.3

Receiving Notification of Documentation Updates 24

11.4

Community Resource............................................ 24

11.5

Trademarks ........................................................... 24

11.6

Electrostatic Discharge Caution ............................ 24

11.7

Glossary ................................................................ 24

12

Mechanical, Packaging, and Orderable

Information ........................................................... 25

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (February 2013) to Revision D

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section .................................................................................................. 1

•

Moved Package thermal resistance (RθJA) rows from Recommended Operating Conditions to Thermal Information........... 4

Changes from Revision B (February 2013) to Revision C

Page

•

Changed layout of National Semiconductor Data Sheet to TI Format ................................................................................... 1