TS2007

Package information

Doc ID 13123 Rev 4

27/29

Figure 55.

DFN8 package mechanical data

Note:

The DFN8 package has an exposed pad E2 x D2. For enhanced thermal performance, the

exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This

copper area can be electrically connected to pin 7 or left floating.

Ref

Dimensions

Millimeters

Mils

Min

Typ

Max

Min

Typ

Max

A

0.50

0.60

0.65

19.6

23.6

25.6

A1

0.02

0.05

0.8

1.9

A3

0.22

8.6

b

0.25

0.30

0.35

9.8

11.8

13.8

D

2.85

3.00

3.15

112.2

118.1

124

D2

1.60

1.70

1.80

63

66.9

70.8

E

2.85

3.00

3.15

112.2

118.1

124

E2

1.10

1.20

1.30

43.3

47.2

51.2

e

0.65

25.5

L(1)

1.

The dimension of L is not compliant with JEDEC MO-248 which recommends 0.40 mm +/-0.10 mm.

0.50

0.55

0.60

19.6

21.6

23.6

ddd

0.08

3.1

SEATING

PLANE

C

D

e

D2

b

12

3

4

8

7

65

Obsolete

Product(s)

- Obsolete

Product(s)