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Figure 28. PowerSO36 Junction-Ambient Thermal Resistance versus On-Board Copper Area.

Figure 29. PowerDIP24 Junction-Ambient Thermal Resistance versus On-Board Copper Area.

Figure 30. SO24 Junction-Ambient Thermal Resistance versus On-Board Copper Area.

Figure 31. Mounting the PowerSO Package.

13

18

23

28

33

38

43

12

3

4

56

7

8

9

10

1 1

1 2

13

W ithout G round La yer

W ith Gr ound La yer

W ith Gr ound La yer + 16 via

Ho le s

sq . c m

ºC / W

On-Board Copper Area

39

40

41

42

43

44

45

46

47

48

49

1

2

3

4

5

6

7

8

9

101112

C opper Are a is on Bo ttom

Sid e

C opper Are a is on To p S i de

sq . cm

ºC / W

On-Board Copper Area

48

50

52

54

56

58

60

62

64

66

68

123

45

6789

10

11

12

C o pp er A rea is o n T op S ide

sq. cm

ºC / W

On-Board Copper Area

Slug soldered

to PCB with

dissipating area

Slug soldered

to PCB with

dissipating area

plus ground layer

Slug soldered to PCB with

dissipating area plus ground layer

contacted through via holes