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STPS30L60CFP Datasheet(PDF) 5 Page - STMicroelectronics |
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STPS30L60CFP Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() STPS30L60C Characteristics Doc ID 6479 Rev 10 5/13 Figure 12. Reverse safe operating area (tp < 1 µs, Tj < 150 °C) Figure 10. Forward voltage drop versus forward current (maximum values, per diode) Figure 11. Thermal resistance junction to ambient versus copper surface under tab for D2PAK 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 1 10 100 200 I (A) FM Tj=25°C Tj=125°C Typical values Tj=150°C V (V) FM 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 S(cm²) R (°C/W) th(j-a) Epoxy printed circuit board copper thickness = 35 µm IARM (A) VARM (V) Operating area Forbidden area 20 22 24 26 28 30 32 34 36 38 40 60 65 70 75 80 85 90 |
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