7

© 2024 Kitagawa GmbH

COOLPROVIDEＴＭ / CPLK

Dual Function Noise Suppression Thermal Pad

Features

CPLK’s low permittivity 14.6/1MHz has a significant effect on noise reduction.

Low-dielectric thermally conductive sheet helps to reduce noise in GHz bands, which

occurs by heat sink’s resonance phenomena.

Silicone-free generates no siloxane gas and oil bleeding.

■

■

■

Thin, permanent

PET film

Low-dielectric thermal

conductive layer

Release liner

■ Resonance Phenomena

※2

The dielectric constant of the TIM has a significant

effect on noise radiation.

Heat sink

Circuit board

Circuit board

ground layer

IC

Thermal

conductive sheet

ε

Resonance frequency is influenced by the dimensions of the heat sink,

as well as the permittivity within the resonator.

eff

■ Effects of Dielectric (measured)

1.0 GHz~1.2 GHz Magnetic field intensity in vicinity of heat sink

No

thermal conductive sheet

With CPLK-F

High

Low

※3 　Relative permittivity：ε′=35

※2　ε

=Equivalent relative permittivity between a heat sink

and a ground layer of a circuit board

eff

With

thermal conductive sheet※3

※1) For usable dimensions, custom cuts, and material yield, contact

　　 your local sales department.

（The values below are not guaranteed.)

Company standard

JIS K 6911

compliant

JIS C

2110-1

compliant

UL94

ー

JIS C

2110-1

compliant

Company standard

ー

JIS Z 8807

JIS K 7

312

ASTM D 2240

JIS K 6251

JIS K 6251

ー

Standard

JIS R

2616

(Hot-wire method)

ISO

22007-2

(Hot Disc method)

ー

Volume Resistivity

Breakdown voltage

Withstanding voltage

Flammability

Operating temp

Available max.

dimension※1

Specific Gravity

Hardness

Tensile strength

Elongation rate

Test type

Thermal

Conductivity

Color

Thickness

Ω

・cm

kV/mm

kV/mm

ー

1MHz

℃

1MHz

ｍｍ

ー

ASKER C

Shore OO

MPa

%

Unit

W/m

・K

ー

ｍｍ

6.6

1.0×1011

3.0

V-0 equivalent

-40～125

200×500

2.0

30

60

0.39

9.1

CPLK-F

1.4

Purple

2.0

1.0/1.

5/2.0

Dielectric constant

Loss tangent

5.40

0.003

ＴＭ

Permeability (µ' = 13)

■

■

■

Excellent EMI absorber performance (µ' = 13 @10MHz) and compliable thermal material

Have excellent adhesion, performs heat conduction and MHz～GHz range electromagnet

（The values below are not guaranteed.）

※1) For usable dimensions, custom cuts, and material yield, contact

　　 your local sales department.

ー

JIS K 7312

ASTM D 2240

JIS K 6251

JIS K 6251

ー

ー

1.5

1.3

1.0／1.5／2.0

2.5／3.0／3.5

3.55

0.51

12

4.2

12.7

0.13

-40～110

210×510

ー

ー

％

Ω

・

ー

℃

・

ー

ー

13

JIS R 2616

（Hot-wire method）

ISO22007-2

JIS C 2110-1

JIS C 2110-1

※1

ｍｍ

ー

ＴＭ

/ EMPV5

■

■

■

■

■

Suppresses noise from 500MHz to 3GHz.

・

Permeability @10MHz: 7

（The values below are not guaranteed.）

※1) For usable dimensions, custom cuts, and material yield, contact

　　 your local sales department.

EMPV5-F

30

5.0

-40～110

210×510

1.0／1.5／2.0

2.5／3.0／3.5

ー

・

―

Ω

・

ー

℃

ー

JIS K 7312

ASTM D 2240

ー

ー

ー

ISO22007-2

ー

※1

JIS C 2110-1

JIS C 2110-1

Thermal+EMC

Thermal+EMC

Silicone-free