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MIL-PRF-19500 Datasheet(PDF) 5 Page - STMicroelectronics |
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MIL-PRF-19500 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 19 page ![]() MIL-PRF-19500/376E 5 A- version NOTES: 1. Die size ...............................................0.015 x 0.019 inches ± 0.001 inch 2. Die thickness.......................................0.010 ± 0.0015 inches 3. Top metal............................................Aluminum 15,000Å minimum, 18,000Å nominal 4. Back metal..........................................A. Gold 2,500Å minimum, 3,000Å nominal B. Eutectic Mount – No Gold 5. Backside .............................................Collector 6. Bonding pad........................................B = 0.003 inches, E = 0.004 inches diameter 7. Passivation .........................................Si3N4 (Silicon Nitride) 2kÅ min, 2.2kÅ nom. FIGURE 4. Physical dimensions, JANHC and JANKC die, A - version. |
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