M95020-RBN3 datasheet(20/37 Pages) STMICROELECTRONICS

20 / 37 page

M95040, M95020, M95010

20/37

MAXIMUM RATING

Stressing the device outside the ratings listed in

Table 7. may cause permanent damage to the de-

vice. These are stress ratings only, and operation

of the device at these, or any other conditions out-

side those indicated in the Operating sections of

this specification, is not implied. Exposure to Ab-

solute Maximum Rating conditions for extended

periods may affect device reliability. Refer also to

the STMicroelectronics SURE Program and other

relevant quality documents.

Table 7. Absolute Maximum Ratings

Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and

the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.

2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500

Ω, R2=500Ω)

Symbol

Parameter

Min.

Max.

Unit

TSTG

Storage Temperature

–65

150

°C

TLEAD

Lead Temperature during Soldering 1

See note 1

°C

Output Voltage

–0.50

VCC+0.6

Input Voltage

–0.50

6.5

VCC

Supply Voltage

–0.50

6.5

VESD

Electrostatic Discharge Voltage (Human Body model) 2

–4000

4000

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