Advance Information

The specifications of this device are subject to change without notice. For latest documentation see http://www.emlsi.com.

2

RMS132UAW

Figure1: Bond Pad Layout (TOP View)

•

Deep Trench Process

•

3 Metal Layers including Local Inter-connection

•Top Metal : Al-Cu

•

Typical Pad Size : 70um X 70um

•

Wafer Diameter : 8 inch

(0,0)

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X

Y

Pad

53

Pad

52

70um

75um

217um

(2332.4, 5826.8)