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150233 Datasheet(PDF) 6 Page - Linear Technology |
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150233 Datasheet(HTML) 6 Page - Linear Technology |
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6 / 8 page ![]() 6 LTC1502-3.3 APPLICATIONS INFORMATION 1 2 3 1502-3.3 F01 4 VCTRL ON OFF 8 7 100 Ω 6 5 VIN GND 10 µF LTC1502-3.3 C2 C1+ C1–/SHDN VOUT C3+ C3 – Figure 1. Pull-Down Circuitry for Shutdown will force a logic high on the C1–/SHDN pin and put the part back into active mode. If no external pull-down is present during the Hi-Z interval, the internal pull-up current will maintain a logic high on the C1–/SHDN pin thereby keep- ing the part in active mode. The shutdown feature can be used to prevent charge pump switching during noise sensitive intervals. Since the charge pump oscillator is disabled during shutdown, output switch- ing noise can be eliminated while the external pull-down is active. The LTC1502-3.3 takes between 20 µs and 50µs to switch from shutdown to active mode once the pull-down device has been turned off (assuming a 100pF external capacitance to GND on the C1–/SHDN pin). A 100k pull-up resistor from VIN to C1–/SHDN will speed up this transition by a factor of five at the expense of 10 µA or so of additional shutdown current. To maintain regulation, a sufficiently large output capacitor must be used to prevent excessive VOUT droop while the charge pump is in shutdown. Also, there must be adequate time for the charge pump to recharge the output capacitor while the part is active. In other words, the average load current must be low enough for the LTC1502-3.3 to maintain a 3.3V output while the part is active. Capacitor Selection For best performance, it is recommended that low ESR capacitors be used for CIN, C2 and COUT to reduce noise and ripple. The CIN, C2 and COUT capacitors should be either ceramic or tantalum and should be 10 µF or greater. If the input source impedance is very low (< 0.5 Ω), CIN may not be needed. Ceramic capacitors are recommended for the flying capacitors C1 and C3 with values of 0.47 µF to 2.2 µF. Smaller values may be used in low output current applications (e.g., IOUT < 1mA). Output Ripple Normal LTC1502-3.3 operation produces voltage ripple on the VOUT pin. Output voltage ripple is required for regulation. Low frequency ripple exists due to the hyster- esis in the sense comparator and propagation delays in the charge pump enable/disable circuits. High frequency ripple is also present mainly from the ESR (equivalent series resistance) in the output capacitor. Typi- cal output ripple (VIN = 1.25V) under maximum load is 50mV peak-to-peak with a low ESR 10 µF output capacitor. The magnitude of the ripple voltage depends on several factors. High input voltages increase the output ripple since more charge is delivered to COUT per charging cycle. Large output current load and/or a small output capacitor (<10 µF) results in higher ripple due to higher output voltage dV/dt. High ESR capacitors (ESR > 0.5 Ω) on the output pin cause high frequency voltage spikes on VOUT with every clock cycle. There are several ways to reduce the output voltage ripple. A larger COUT capacitor (22µF or greater) will reduce both the low and high frequency ripple due to the lower COUT charging and discharging dV/dt and the lower ESR typi- cally found with higher value (larger case size) capacitors. A low ESR ceramic output capacitor will minimize the high frequency ripple, but will not reduce the low frequency ripple unless a high capacitance value is chosen. A reason- able compromise is to use a 10 µF to 22µF tantalum capacitor in parallel with a 1 µF to 3.3µF ceramic capacitor on VOUT to reduce both the low and high frequency ripple. An RC filter may also be used to reduce high frequency voltage spikes (see Figure 2). LTC1502-3.3 10 µF TANTALUM VOUT VOUT VOUT 1 µF CERAMIC 2 Ω 8 8 10 µF10µF VOUT 1502-3.3 F02 + + + LTC1502-3.3 Figure 2. Output Ripple Reduction Techniques |
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