75331 datasheet(2/3 Pages) MOLEX

2 / 3 page

1.85 by 1.85mm (.073

by .073”) pitch GbX*

Backplane connector system

in 2, 3, 4 and 5-pair

columns

appLications

Internetworking Equipment:

- Servers, Hubs, and Routers

Telecommunications Equipment:

- Central Office, Cellular Infrastructure and

Multi-platform Service (DSL, Cable Data) systems

Medical Diagnostic Equipment

Test and Measurement Equipment

speciFications

Reference Information

Packaging:

Daughtercard Assemblies: Tray

Backplane Headers: 2, 4 and 5 Pair- Tray;

3 Pair- Tube

UL File No.: E29179

Designed In: Millimeters

Electrical

Signal/Shield Contact Current Rating: 1.0A

Power Contact Current Rating: 6.0A

Contact to Plated-Through-Hole Resistance:

1.0 milliohm max.

Power Blade Contact Resistance: 3.0 milliohms max.

Dielectric Withstanding Voltage: 750V RMS

Insulation Resistance: 1,000 Megohms min.

Mechanical

Contact Insertion Force: 35.58N (8.00 lb) max. per

contact

Contact Retention Force: 6.67N (1.50 lb) min. per

contact

Mating Force: 0.59N (0.13 lb) max. per contact

Unmating Force: 0.342N (0.077 lb) min. per contact

Durability: 250 cycles max.

Physical

Housing: Liquid Crystal Polymer, UL 94V-0

Contact: Copper Alloy

Plating:

Contact Area – 0.76μm (30μ”) Gold (Au) min.

Compliant Pin Area – Tin (Sn) or Tin/Lead (SnPb)

Underplating – Nickel (Ni)

PCB Thickness: 1.60mm (.062”) min.

Operating Temperature: -55 to +105°C

2 and 3-pair:

Top, left to right: 75370, 75650

Bottom, left to right: 75433, 75827

4 and 5-pair:

Top: 75220

Bottom: 75235

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