IP4286CZ6_1

© NXP B.V. 2009. All rights reserved.

Objective data sheet

Rev. 01 — 20 April 2009

9 of 12

NXP Semiconductors

IP4286CZ6

Integrated 4-channel ESD protection

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

9.

Abbreviations

MSL: Moisture Sensitivity Level

Fig 5.

Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 7.

Abbreviations

Acronym

Description

DVI

Digital Visual Interface

ESD

ElectroStatic Discharge

HDMI

High-Definition Multimedia Interface

LAN

Local Area Network

PCS

Personal Communications Services

PDA

Personal Digital Assistant

RoHS

Restriction of Hazardous Substances

USB

Universal Serial Bus

WAN

Wide Area Network