M24M01-HRCS3GSLASHA datasheet(29/37 Pages) STMICROELECTRONICS

29 / 37 page

M24M01-R, M24M01-W, M24M01-HR

Package mechanical data

Doc ID 12943 Rev 7

29/37

Figure 16.

WLCSP8 – Wafer level chip scale package outline

Drawing is not to scale and corresponds to preliminary data.

The dimension is measured at the maximum bump diameter parallel to primary datum Z.

The primary datum Z and seating plane are defined by the spherical crowns of the bump.

Bump position designation per JESD 95-1, SPP-010.

Table 17.

WLCSP8 – Wafer level chip scale package mechanical data(1)

Preliminary data.

Symbol

millimeters

inches(2)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.580

0.555

0.605

0.0228

0.0219

0.0238

0.230

0.0091

0.350

0.0138

0.322

0.0127

3.570

3.685

0.1406

0.1451

2.050

2.165

0.0807

0.0852

0.600

0.0236

2.400

0.0945

1.200

0.0472

0.585

0.0230

0.424

0.0167

aaa

0.110

0.0043

bbb

0.110

0.0043

ccc

0.110

0.0043

ddd

0.060

0.0024

eee

0.060

0.0024

N (number of bumps) 8

Orientation reference

Wafer’s back side

Side view

Bump side

Orientation

reference

Detail A

Bump

Seating plane(3)

Detail A rotated by 90°

b(8X)(2)

Note 4

(4X)

eee Z

aaa

E1_ME

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