For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

3

3 - 5

Absolute Maximum Ratings

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

HMC724LC3C

v03.1010

14 Gbps FAST RISE TIME

1:2 FANOUT BUFFER

NOTES:

1. PACKAGE BODY MATERIAL: ALUMINA

2. LEAD AND GROUND PADDLE PLATING:

30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm DATUM -C-

6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

7. PADDLE MUST BE SOLDERED TO GND.

Power Supply Voltage (Vee)

-3.75 V to +0.5 V

Input Signals

-2 V to +0.5 V

Output Signals

-1.5 V to +1 V

Continuous Pdiss (T = 85 °C)

(derate 17 mW/°C above 85 °C)

0.68 W

case junction to package paddle

59 °C/W

Maximum Junction Temperature

125 °C

Storage Temperature

-65 °C to +150 °C

Operating Temperature

-40 °C to +85 °C