Datasheet

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TSZ02201-0RAR0G200100-1-2

© 2012 ROHM Co., Ltd. All rights reserved.

36/39

27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Operational Notes

1) Unused circuits

When there are unused circuits it is recommended that they are connected

as in Fig.100, setting the non-inverting input terminal to a potential within

input common-mode voltage range (Vicm).

2) Input terminal voltage

Applying GND + 36V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input voltage is

within the common mode input voltage range of the electric characteristics.

3) Power supply (single / dual)

The op-amp operates when the specified voltage supplied is between VCC

and VEE. Therefore, the single supply op-amp can be used as dual supply

op-amp as well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in

chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation

(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating

curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and

the power supply, or the output and GND may result in IC destruction.

6) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

7) Radiation

This IC is not designed to withstand radiation.

8) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical

characteristics due to piezoelectric (piezo) effects.

9) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the

power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly

process as well as during transportation and storage.

10) Output capacitor

Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,

causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation

due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance

less than 0.1µF.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Fig.100 Unused circuit example

VCC

VEE

+

-

Please keep this

potential in Vicm