ADRF6516ACPZ-R7 datasheet(29/32 Pages) AD

29 / 32 page

Data Sheet

ADRF6516

Rev. B | Page 29 of 32

OUTLINE DIMENSIONS

3.25

3.10 SQ

2.95

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

COPLANARITY

0.08

3.50 REF

0.50

BSC

PIN 1

INDICATOR

PIN 1

INDICATOR

0.30

0.25

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

0.50

0.40

0.30

5.00

BSC SQ

4.75

BSC SQ

0.60 MAX

0.25 MIN

TOP VIEW

EXPOSED

PAD

BOTTOM VIEW

Figure 62. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADRF6516ACPZ-R7

−40°C to +85°C

32-Lead LFCSP_VQ, 7”Tape and Reel

CP-32-2

ADRF6516-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

ADRF6516ACPZ-R7 Datasheet(PDF) 29 Page - Analog Devices

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