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AP2331 Datasheet(PDF) 3 Page - Diodes Incorporated

Part # AP2331
Description  0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
PDF  11 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP2331 Datasheet(HTML) 3 Page - Diodes Incorporated

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AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2
3 of 11
www.diodes.com
May 2012
© Diodes Incorporated
Electrical Characteristics (TA = 25°C, VIN = +5.0V, unless otherwise stated.)
Symbol
Parameter
Test Conditions (Note 5)
Min
Typ.
Max
Unit
VUVLO
Input UVLO
VIN rising
2.35
2.65
V
IQ
Input quiescent current
Above UVLO, IOUT = 0
85
125
µA
IREV
Reverse leakage current
VIN = 0V, VOUT = 5V, IREV at VIN
0.01
0.10
µA
RDS(ON)
Switch on-resistance
VIN = 5V, IOUT = 0.2A
100
250
350
m
ILIMIT
Over-load current limit
VIN = 5V, VOUT = 4V
0.3
0.4
0.5
A
IOS
Short-circuit current
OUT shorted to ground
0.3
0.4
0.5
A
IROCP
Reverse-current trigger point
VIN = 5.0V, VOUT = 5.2V
0.20
0.25
A
TTRIG
Deglitch time from reverse current trigger
to MOSFET turn off
(Note 6)
0.5
0.7
1.0
ms
VOVP
Output over-voltage trip point
(Note 7)
5.3
5.6
V
TOVP
Debounce time from output over-voltage
to MOSFET turn off
15
µs
VREC
Recovery after turn-off from ROCP and
OVP
101%
VIN
TON
Output turn-on time (Note 8)
CL = 0.1µF, RLOAD = 20Ω
(UVLO to 90% VOUT-NOM)
0.7
ms
TSHDN
Thermal shutdown threshold
VIN = 2.7V to 5.2V
150
°C
THYS
Thermal shutdown hysteresis
20
°C
θJA
Thermal Resistance Junction-to-Ambient
(Note 9)
SOT23
215
oC/W
SC59
255
oC/W
Notes:
5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. When reverse current triggers at IROCP = 0.20A, the reverse current is continuously clamped at IROCP for 0.7ms deglitch time until MOSFET is
turned off.
7. During output over-voltage protection, the output draws approximately 60µA current.
8. Since the output turn-on slew rate is dependent on input supply slew rate, this limit is only applicable for input supply slew rate between VIN/0.2ms to
VIN/1ms.
9. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.



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