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M24C01-W Datasheet(PDF) 30 Page - STMicroelectronics

Part # M24C01-W
Description  Enhanced ESD/latch-up protection, More than 40-year data retention
PDF  38 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24C01-W Datasheet(HTML) 30 Page - STMicroelectronics

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Package mechanical data
M24C16, M24C08, M24C04, M24C02, M24C01
30/38
Doc ID 5067 Rev 17
Figure 15.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
1.
Drawing is not to scale.
2.
The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3.
The circle in the top view of the package indicates the position of pin 1.
Table 21.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
Note
Typ
Min
Max
Typ
Min
Max
A
0.550
0.450
0.600
0.0217
0.0177
0.0236
A1
0.020
0.000
0.050
0.0008
0.0000
0.0020
b
0.250
0.200
0.300
0.0098
0.0079
0.0118
D
2.000
1.900
2.100
0.0787
0.0748
0.0827
D2 (MB)
1.600
1.500
1.700
0.0630
0.0591
0.0669
D2 (MC)
-
1.200
1.600
-
0.0472
0.0630
E
3.000
2.900
3.100
0.1181
0.1142
0.1220
E2 (MB)
0.200
0.100
0.300
0.0079
0.0039
0.0118
E2 (MC)
-
1.200
1.600
-
0.0472
0.0630
e
0.500
-
-
0.0197
-
-
K
-
0.300
-
-
0.0118
-
L
-
0.300
0.500
-
0.0118
0.0197
L1
-
0.150
-
-
0.0059
L3
-
0.300
-
-
0.0118
-
eee
0.080
0.0031
(2)
2.
Applied for exposed die paddle and terminals. Excludes embedding part of exposed die paddle from
measuring.



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