MPC8280 datasheet(79/83 Pages) FREESCALE

79 / 83 page

MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2

Freescale Semiconductor

Ordering Information

10 Ordering Information

This figure provides an example of the Freescale part numbering nomenclature for the SoC. In addition to

the processor frequency, the part numbering scheme also consists of a part modifier that indicates any

enhancement(s) in the part from the original production design. Each part number also contains a revision

code that refers to the die mask revision number and is specified in the part numbering scheme for

identification purposes only. For more information, contact your local Freescale sales office.

Figure 19. Freescale Part Number Key

11 Document Revision History

This table summarizes changes to this document.

Table 27. Document Revision History

Revision

Date

Substantive Changes

09/2011

In Figure 19, “Freescale Part Number Key,” added speed decoding information below processor

frequency information.

1.8

07/2007

• Updated the entire document, adding information on the VV package.

1.7

12/2006

• Section 6, “AC Electrical Characteristics,” removed deratings statement and clarified AC

timing descriptions.

1.6

05/2006

• Table 11: Added text to clarify that Data Bus Parity is not supported at 66 Mhz.

• Table 11: Added text to clarify that Data Bus ECC is supported at 66 Mhz

• Table 11: Added note to DP pins to show it is not supported at 66 MHz

• Table 12: Added note to support 1 ns hold time

1.5

03/2006

• Added Section 6.3, “JTAG Timings”

Product code

Device number

Processor frequency

Die revision level

MPC 82XX C ZU XXX

(CPU/CPM/Bus in MHz)

Temperature range

Blank = 0T

to 105Tj

C = (–40)T

– 105Tj

B = 66

E = 100

F = 133

I = 200

M = 266

P = 300

T = 400

Package

ZU = 480 TBGA lead spheres

VV = 480 TBGA lead-free spheres

VR = 516 PBGA lead-free spheres

ZQ = 516 PBGA lead sphere

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